Area array packaging, comprising the use of ball grid array (BGA), chip scale package (CSP) and flip chip (FC) technologies, is the fastest growing segment of the electronics packaging and manufacturing market. It is being driven by the increased need for high density interconnects (HDI) for portable communications devices like laptops, cell phones, palm tops and micro-browsers. Packaging is the bottleneck in creating these micro-devices, and area array packaging, creating packages 20 times smaller than those of traditional ...
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Area array packaging, comprising the use of ball grid array (BGA), chip scale package (CSP) and flip chip (FC) technologies, is the fastest growing segment of the electronics packaging and manufacturing market. It is being driven by the increased need for high density interconnects (HDI) for portable communications devices like laptops, cell phones, palm tops and micro-browsers. Packaging is the bottleneck in creating these micro-devices, and area array packaging, creating packages 20 times smaller than those of traditional packaging, is the solution.
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Add this copy of Area Array Packaging Handbook: Manufacturing and to cart. £78.52, new condition, Sold by discount_scientific_books rated 5.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 2001 by McGraw-Hill Professional Publishing.
Add this copy of Area Array Packaging Handbook: Manufacturing and to cart. £108.50, new condition, Sold by Just one more Chapter rated 4.0 out of 5 stars, ships from Miramar, FL, UNITED STATES, published 2001 by McGraw-Hill Professional.
