This text covers ball grid array (BGA) design and manufacturing. BGA is a relatively new way of connecting leads from an integrated circuit package to a printed circuit board, allowing a higher pin count and function density than other connection methods and giving the lowest signal delay. These features make it an important component of modern high performance systems, but the density of leads makes manufacturing and process control very difficult.
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This text covers ball grid array (BGA) design and manufacturing. BGA is a relatively new way of connecting leads from an integrated circuit package to a printed circuit board, allowing a higher pin count and function density than other connection methods and giving the lowest signal delay. These features make it an important component of modern high performance systems, but the density of leads makes manufacturing and process control very difficult.
Read Less
Add this copy of Ball Grid Array Technology to cart. $118.44, new condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Santa Clarita, CA, UNITED STATES, published 1994 by McGraw-Hill Professional.
