3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in ...
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3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
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Add this copy of Design and Modeling for 3d Ics and Interposers (Wspc to cart. $122.20, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Santa Clarita, CA, UNITED STATES, published 2014 by World Scientific Pub Co Inc.
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PLEASE NOTE, WE DO NOT SHIP TO DENMARK. New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK.
Add this copy of Design and Modeling for 3d Ics and Interposers (Wspc to cart. $159.63, new condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Santa Clarita, CA, UNITED STATES, published 2014 by World Scientific Pub Co Inc.
Add this copy of Design and Modeling for 3d Ics and Interposers to cart. $73.47, new condition, Sold by discount_scientific_books rated 5.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 2013 by World Scientific Publishing Co Pte Ltd.
Add this copy of Design and Modeling for 3d Ics and Interposers to cart. $77.09, new condition, Sold by discount_scientific_books rated 5.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 2013 by World Scientific Publishing Co Pte Ltd.
Add this copy of Design and Modeling for 3d Ics and Interposers to cart. $94.25, new condition, Sold by discount_scientific_books rated 5.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 2013 by World Scientific Publishing Co Pte Ltd.
Add this copy of Design and Modeling for 3d Ics and Interposers to cart. $99.01, new condition, Sold by discount_scientific_books rated 5.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 2013 by World Scientific Publishing Co Pte Ltd.
Add this copy of System Integration and Modeling Concepts; Modeling of to cart. $113.73, new condition, Sold by Media Smart rated 4.0 out of 5 stars, ships from Hawthorne, CA, UNITED STATES, published 2013 by World Scientific Publishing Company, Incorporated.
