Proceeding of the 3rd International Conference on Electronics, Biomedical Engineering, and Health Informatics: ICEBEHI 2022, 5-6 October, Surabaya, Indonesia
Proceeding of the 3rd International Conference on Electronics, Biomedical Engineering, and Health Informatics: ICEBEHI 2022, 5-6 October, Surabaya, Indonesia
This book presents high-quality peer-reviewed papers from the International Conference on Electronics, Biomedical Engineering, and Health Informatics (ICEBEHI) 2022 held at Surabaya, Indonesia, virtually. The contents are broadly divided into three parts: (a) Electronics, (b) Biomedical Engineering, and (c) Health Informatics. The major focus is on emerging technologies and their applications in the domain of biomedical engineering. It includes papers based on original theoretical, practical, and experimental simulations, ...
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This book presents high-quality peer-reviewed papers from the International Conference on Electronics, Biomedical Engineering, and Health Informatics (ICEBEHI) 2022 held at Surabaya, Indonesia, virtually. The contents are broadly divided into three parts: (a) Electronics, (b) Biomedical Engineering, and (c) Health Informatics. The major focus is on emerging technologies and their applications in the domain of biomedical engineering. It includes papers based on original theoretical, practical, and experimental simulations, development, applications, measurements, and testing. Featuring the latest advances in the field of biomedical engineering applications, this book serves as a definitive reference resource for researchers, professors, and practitioners interested in exploring advanced techniques in the fields of electronics, biomedical engineering, and health informatics. The applications and solutions discussed here provide excellent reference material for future product development.
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Add this copy of Proceeding of the 3rd International Conference on to cart. £301.99, new condition, Sold by Media Smart rated 3.0 out of 5 stars, ships from Hawthorne, CA, UNITED STATES, published 2023 by Springer Verlag, Singapore.