In the past few years, System-in-Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. This comprehensive resource on SiP design techniques offers designers state-of-the-art packaging know-how.
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In the past few years, System-in-Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. This comprehensive resource on SiP design techniques offers designers state-of-the-art packaging know-how.
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Add this copy of System-in-Package Rf Design and Applications to cart. $101.81, good condition, Sold by HPB-Red rated 5.0 out of 5 stars, ships from Dallas, TX, UNITED STATES, published 2007 by Artech House Publishers.
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Add this copy of System-in-Package Rf Design and Applications to cart. $164.64, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Santa Clarita, CA, UNITED STATES, published 2007 by Artech House Publishers.
Add this copy of System-in-Package Rf Design and Applications to cart. $209.04, new condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Santa Clarita, CA, UNITED STATES, published 2007 by Artech House Publishers.
