This book presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability, and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials, and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) ...
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This book presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability, and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials, and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical, and stress modeling methodologies is also provided. This book also: ] Covers the development of wafer-level power discrete packaging with regular wafer-level design concepts and directly bumping technology ] Introduces the development of the analog and power SIP/3D/TSV/stack die packaging technology ] Presents the wafer-level analog IC packaging design through fan-in and fan-out with RDLs.
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Add this copy of Wafer-Level Chip-Scale Packaging: Analog and Power to cart. $215.03, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Santa Clarita, CA, UNITED STATES, published 2016 by Springer.
Add this copy of Wafer-Level Chip-Scale Packaging: Analog and Power to cart. $344.00, new condition, Sold by Media Smart rated 4.0 out of 5 stars, ships from Hawthorne, CA, UNITED STATES, published 2016 by Springer.
Add this copy of Wafer-Level Chip-Scale Packaging: Analog and Power to cart. $116.95, like new condition, Sold by Salish Sea Books rated 3.0 out of 5 stars, ships from Bellingham, WA, UNITED STATES, published 2014 by Springer-Verlag Publishing.
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Fine/As New; Hardcover; Covers are still glossy with "sharp" edge-corners; Unblemished textblock edges; The endpapers and text pages are all bright and unmarked; The binding is tight with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium Format (8.5"-9.75" tall); 1.4 lbs; Dark red covers with title in white lettering; 2014, Springer-Verlag Publishing; 339 pages; "Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications, " by Shichun Qu & Yong Liu.
Add this copy of Wafer-Level Chip-Scale Packaging: Analog and Power to cart. $117.91, very good condition, Sold by Books From California rated 4.0 out of 5 stars, ships from Simi Valley, CA, UNITED STATES, published 2014 by Springer.
Add this copy of Wafer-Level Chip-Scale Packaging: Analog and Power to cart. $155.96, like new condition, Sold by GreatBookPricesUK5 rated 4.0 out of 5 stars, ships from Castle Donington, DERBYSHIRE, UNITED KINGDOM, published 2014 by Springer.
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Fine. Sewn binding. Cloth over boards. 322 p. Contains: Unspecified, Illustrations, black & white, Illustrations, color, Tables, black & white. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
