Wire bonds are used to interconnect integrated circuits, multichip modules and hybrids, and microwave as well as power devices to their packages. This is a reference on wire bonding. It emphasis on fine pitch bonding, bonding to MCMs, and additional areas.
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Wire bonds are used to interconnect integrated circuits, multichip modules and hybrids, and microwave as well as power devices to their packages. This is a reference on wire bonding. It emphasis on fine pitch bonding, bonding to MCMs, and additional areas.
Read Less
Add this copy of Wire Bonding in Microelectronics: Materials, Processes, to cart. £91.59, good condition, Sold by BayStateBooks rated 5.0 out of 5 stars, ships from North Smithfield, RI, UNITED STATES, published 1997 by McGraw-Hill Professional.
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Seller's Description:
The book is in good condition with all pages and cover intact including the dust jacket if originally issued. The spine may show light wear. Pages may contain some notes or highlighting and there might be a From the library of label. Boxed set packaging shrink wrap or included media like CDs may be missing.
Add this copy of Wire Bonding in Microelectronics: Materials, Processes, to cart. £92.82, good condition, Sold by BooksRun rated 4.0 out of 5 stars, ships from Philadelphia, PA, UNITED STATES, published 1997 by McGraw-Hill Professional.
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Seller's Description:
It's a preowned item in good condition and includes all the pages. It may have some general signs of wear and tear, such as markings, highlighting, slight damage to the cover, minimal wear to the binding, etc., but they will not affect the overall reading experience.
Add this copy of Wire Bonding in Microelectronics: Materials, Processes, to cart. £157.17, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Santa Clarita, CA, UNITED STATES, published 1997 by McGraw-Hill Professional.
