-
Recommended Copy
Additional copies that match your search:
-
1. Interconnect Reliability in Advanced Memory Device Packaging
by Chong Leong Gan, Gan, Chen-Yu Huang, Huang
Seller Description: PLEASE NOTE, WE DO NOT SHIP TO DENMARK. New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK. See More Details
2023, Springer Nature B. V
ISBN-13: 9783031267093
Softcover, New
Fairford, GLOUCESTERSHIRE, UNITED KINGDOM
£44.67
-
2. Interconnect Reliability in Advanced Memory Device Packaging
by Chong Leong Gan, Gan, Chen-Yu Huang, Huang
Seller Description: PLEASE NOTE, WE DO NOT SHIP TO DENMARK. New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK. See More Details
2023, Springer Nature B. V
ISBN-13: 9783031267093
Softcover, New
Fairford, GLOS, UNITED KINGDOM
£47.46
-
3. Interconnect Reliability in Advanced Memory Device Packaging
by Chong Leong, Gan; Chen-Yu, Huang
eBook See More Details
Springer Nature
eBook ISBN: 9783031267079
Format: EPUB eBook
Digital download
£177.87
-
4. Interconnect Reliability in Advanced Memory Device Packaging
by Chong Leong Gan, Gan, Chen-Yu Huang, Huang
Seller Description: New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK. See More Details
2023, Springer Nature B. V
ISBN-13: 9783031267093
Softcover, New
Bensenville, IL, USA
£61.29
-
5. Interconnect Reliability in Advanced Memory Device Packaging
by Gan, Chong Leong,, and Huang, Chen-Yu,
Seller Description: New. Contains: Illustrations, black & white, Illustrations, color. Springer Series in Reliability Engineering . XVIII, 210 p. 100 illus., 89 illus. in color. Intended for professional and scholarly audience. See More Details
2023, Springer International Publishing AG
ISBN-13: 9783031267079
Hardcover, New
NV, USA
£174.37
-
6. Interconnect Reliability in Advanced Memory Device Packaging
by Gan, Chong Leong,, and Huang, Chen-Yu,
Seller Description: Fine. Contains: Illustrations, black & white, Illustrations, color. Springer Series in Reliability Engineering . XVIII, 210 p. 100 illus., 89 illus. in color. Intended for professional and scholarly audience. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited ... See More Details
2023, Springer International Publishing AG
ISBN-13: 9783031267079
Hardcover, Fine/Like New
Columbia, MD, USA
£200.08
-
7. Interconnect Reliability in Advanced Memory Device Packaging
by Gan, Chong Leong,, and Huang, Chen-Yu,
Seller Description: New. Contains: Illustrations, black & white, Illustrations, color. Springer Series in Reliability Engineering . XVIII, 210 p. 100 illus., 89 illus. in color. Intended for professional and scholarly audience. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited ... See More Details
2023, Springer International Publishing AG
ISBN-13: 9783031267079
Hardcover, New
Columbia, MD, USA
£200.28
