Dealing with BGA, CSP, flip chips and other new technologies that underlie the electronics industry's need for smaller, faster products, this text explains the fundamentals of solder joint reliability and presents creative, robust packaging techniques for cost-effective interconnection.
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Dealing with BGA, CSP, flip chips and other new technologies that underlie the electronics industry's need for smaller, faster products, this text explains the fundamentals of solder joint reliability and presents creative, robust packaging techniques for cost-effective interconnection.
Read Less
Add this copy of Solder Joint Reliability of Bga, Csp, Flip Chip, and to cart. $9.48, very good condition, Sold by ThriftBooks-Baltimore rated 5.0 out of 5 stars, ships from Halethorpe, MD, UNITED STATES, published by McGraw-Hill Professional.
Add this copy of Solder Joint Reliability of Bga, Csp, Flip Chip, and to cart. $12.64, very good condition, Sold by GuthrieBooks rated 5.0 out of 5 stars, ships from Spring Branch, TX, UNITED STATES, published 1996 by McGraw-Hill Professional.
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Very Good. Size: 6x1x9; Ex-Library hardcover in very nice condition with the usual markings and attachments. Except for library markings, interior clean and unmarked. Tight binding.
Add this copy of Solder Joint Reliability of BGA, CSP, Flip Chip, and to cart. $13.00, very good condition, Sold by Booksup rated 5.0 out of 5 stars, ships from Laguna Niguel, CA, UNITED STATES, published 1996 by McGraw-Hill Professional Publishing.
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Add this copy of Solder Joint Reliability of Bga, Csp, Flip Chip, and to cart. $38.31, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Santa Clarita, CA, UNITED STATES, published 1996 by McGraw-Hill Professional.
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Add this copy of Solder Joint Reliability of Bga, Csp, Flip Chip, and to cart. $327.00, very good condition, Sold by BingoBooks2 rated 4.0 out of 5 stars, ships from Vancouver, WA, UNITED STATES, published 1996 by Blacklick, Ohio, U.S.A. : McGraw-Hill.