The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. Topics include: Failure Analysis Process and ...
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The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. Topics include: Failure Analysis Process and Management-wafer, package, and board level failure analysis flow. Incoming Inspection Tools-optical, x-ray, and scanning acoustic microscopy. Fault Isolation-front and backside sample prepara tion, CAD navigation, laser-assisted device alteration (LADA), soft defect location (SDL), lock-in thermog raphy, laser voltage probing (LVP), photon emission, EOTPR/TDR/TDT, and current imaging. Device and Circuit Characterization-scanning electron microscopy (SEM)-based and atomic force microscopy (AFM)-based nanoprobing. FIB Technique and Circuit Edit- FIB overview and advanced circuit edit for first silicon debug. Physical Analysis-deprocessing, cross section analysis, scanning electron microscopy, material analysis techniques, transmission electron micros copy (TEM), and scanning probe microscopy. Memory FA-DRAM, semiconductor memory failure signature analysis. Special Applications-automotive FA, 2.5 and 3D packaging failure analysis, microelectromechanical systems (MEMS), optoelectronics, solar, and counterfeit electronics. Fundamental Topics-integrated circuit testing, analog design, reliability, quality, and training. Seven new topics have been added and all themes covered in earlier editions are included in the Seventh Edition. Many previous articles have been updated.
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Add this copy of Microelectronics Failure Analysis Desk Reference to cart. $255.97, like new condition, Sold by GreatBookPricesUK5 rated 4.0 out of 5 stars, ships from Castle Donington, DERBYSHIRE, UNITED KINGDOM, published 2019 by A S M International.
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Fine. Intended for professional and scholarly audience. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Add this copy of Microelectronics Failure Analysis Desk Reference to cart. $290.65, like new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2019 by A S M International.
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
Fine. Intended for professional and scholarly audience. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
