This engineering reference covers new techniques in electronic packaging - flip chip, BGA, and MEMs. It includes high density packaging and cleaning options.
Read More
This engineering reference covers new techniques in electronic packaging - flip chip, BGA, and MEMs. It includes high density packaging and cleaning options.
Read Less
Add this copy of Area Array Package Design: Techniques in High Density to cart. £71.81, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Santa Clarita, CA, UNITED STATES, published 2003 by McGraw-Hill Professional.
Add this copy of Area Array Package Design: Techniques in High Density to cart. £88.52, new condition, Sold by Just one more Chapter rated 4.0 out of 5 stars, ships from Miramar, FL, UNITED STATES, published 2003 by McGraw-Hill Professional Publishing.
