SiP System-in-Package Design...
Suny Li (Li Yang)
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Foldable Flex and Thinned...
John W. Balde (Editor)
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MCM C/Mixed Technologies and...
W K Jones (Editor),
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Physical Design for Multichip...
Mysore Sriram,
Sung-Mo (Steve) Kang
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Multichip Modules with...
W K Jones (Editor),
Gábor Harsányi (Editor)
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Conceptual Design of...
Peter A. Sandborn,
Hector Moreno
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System on Package:...
Rao Tummala
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System-In-Package RF Design...
Michael P Gaynor
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eBook from $82.00
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Area Array Packaging Processes
Ken Gilleo
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Area Array Packaging Processes
Ken Gilleo
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Foldable Flex and Thinned...
John W Balde (Editor)
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eBook from $47.70
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Low Cost Flip Chip...
John H Lau,
C P Wong (Foreword by)
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Advanced Electronic Packaging...
William D Brown (Editor)
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Thermal Management Handbook:...
Jerry E Sergent,
Al Krum
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Multi-Chip Module Test...
Yervant Zorian (Editor)
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Flip Chip Technologies
John H Lau
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Introduction to Multichip...
Naveed A Sherwani,
Qiong Yu
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MCM C/Mixed Technologies and...
W K Jones (Editor),
Karel Kurzweil (Editor)
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Physical Design for Multichip...
Mysore Sriram,
Sung-Mo (Steve) Kang
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Integrated Circuit, Hybrid,...
Michael G Pecht
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Multichip Module Design Fabr...
James J Licari,
Licari
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Electronics Packaging Forum:...
James E Morris (Editor),
Thomas J Watson (Editor)
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Conceptual Design of...
Peter A Sandborn,
Hector Moreno
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Microelectronic System...
Stuart K Tewksbury,
Stuart K Tewskbury (Editor)
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