This engineering reference covers the most important assembly processes in modern electronic packaging. It includes flip chip assembly and processes, die-attach, and BGA and CSP rework.
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This engineering reference covers the most important assembly processes in modern electronic packaging. It includes flip chip assembly and processes, die-attach, and BGA and CSP rework.
Read Less
Add this copy of Area Array Packaging Processes: for Bga, Flip Chip, and to cart. $44.50, good condition, Sold by Second Story Books rated 4.0 out of 5 stars, ships from Rockville, MD, UNITED STATES, published 2004 by The McGraw-Hill Companies, Inc.
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Seller's Description:
Book. Octavo; VG-; dark blue spine with white text; ex-library; first thus; cloth exterior has slight handling wear; ex-library sticker to spine; small sticker to rear; light wear to corners; strong binding; no jacket; text block exterior edges have light wear; few ex-library markings to endpapers; interior good otherwise; illustrated; pp 260. 1365311. FP New Rockville Stock.
Add this copy of Area Array Packaging Processes: for Bga, Flip Chip, and to cart. $51.77, like new condition, Sold by Solomon's Mine Books rated 5.0 out of 5 stars, ships from Howard, PA, UNITED STATES, published 2003 by McGraw-Hill Professional.
Add this copy of Area Array Packaging Processes to cart. $91.22, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Santa Clarita, CA, UNITED STATES, published 2003 by McGraw-Hill.
